Name:
IEC/TR 63357 Ed. 1.0 en:2022 PDF
Published Date:
10/01/2022
Status:
Active
Publisher:
International Electrotechnical Commission - Technical Report
This Technical Report describes standardization roadmap of fault test methods for integrated circuits used in automotive vehicles. Since automotive vehicles are exposed in harsh environment such as very low or high temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment. There are several fault test methods and related issues to be standardized.
Semiconductor devices used in automotive vehicles are exposed in harsh environment of very high or very low temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment Evaluation results following this fault test methods will provide robustness of the semiconductor device.
| File Size : | 1 file , 1.6 MB |
| ISBN(s) : | 9782832257661 |
| Note : | This product is unavailable in Russia, Belarus, Ukraine, Canada |
| Number of Pages : | 18 |
| Published : | 10/01/2022 |
